Bondlinc goes to KL!

Shortly after our Echelon experience, BondLinc is back for more FinTech fairs! BondLinc will be going to Kuala Lumpur from the 5th to the 6th of July. We will be participating in the event Building Global FinTech Connections: Singapore with Kuala Lumpur organised by the Monetary Authority of Singapore (MAS).

 

This is a great opportunity for us to meet other FinTech startups and parties interested in FinTech developments. We are always on the lookout for potential partners that would work with us and help us extend our reach in the region. 

 

We will be manning our booth in the event as one of the finalists of The Finlab (Cycle 2). Do look out for our booth located in the UOB cluster and drop by if available!

 

Details about the event can be found here.